SK Hynix Plans to Invest $13 Billion in New Chip Packaging Plant

SK Hynix Plans to Invest  Billion in New Chip Packaging Plant



SK Hynix Plans to Invest $13 Billion in New Chip Packaging Plant
SK Hynix Inc. plans to spend 19 trillion won ($12.9 billion) building a new advanced chip packaging facility, initiating a big expansion in anticipation of AI demand.


www.bloomberg.com
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